Electroless plating - Company Ranking(8 companies in total)
Last Updated： Aggregation Period:Jul 08, 2026〜Aug 04, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Supported Materials】 ■Electrode Materials: Cu, Ag ■Plating Thickness ・Ni (1 to 10μm) ・Au (0.05 to 0.4μm) ■Substrate Size ・Cu electrode p... | 【Applications】 ■IC packages ■Mainframe computers ■Computers, etc. *For more details, please refer to the PDF document or feel free to conta... | ||
| 【Supported Materials】 ■Electrode Materials: Cu, Ag ■Plating Thickness ・Ni (1 to 10μm) ・Au (0.05 to 0.4μm) ■Substrate Size ・Cu electrode p... | 【Applications】 ■IC packages ■Mainframe computers ■Computers, etc. *For more details, please refer to the PDF document or feel free to conta... | ||
| 【Supported Materials】 ■Materials: Power semiconductors such as Si, SiC, GaO, GaN ■Al-based electrodes: Pure Al, AlSi, AlSiCu, AlCu *For mor... | 【Applications】 ■ Power devices for automotive and home appliances ■ Sensor devices ■ ASIC devices for MEMS, etc. *For more details, please ... | ||
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清川メッキ工業
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- Featured Products
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Electroless plating technology for substrates
- overview
- 【Supported Materials】 ■Electrode Materials: Cu, Ag ■Plating Thickness ・Ni (1 to 10μm) ・Au (0.05 to 0.4μm) ■Substrate Size ・Cu electrode p...
- Application/Performance example
- 【Applications】 ■IC packages ■Mainframe computers ■Computers, etc. *For more details, please refer to the PDF document or feel free to conta...
Electroless plating technology for substrates
- overview
- 【Supported Materials】 ■Electrode Materials: Cu, Ag ■Plating Thickness ・Ni (1 to 10μm) ・Au (0.05 to 0.4μm) ■Substrate Size ・Cu electrode p...
- Application/Performance example
- 【Applications】 ■IC packages ■Mainframe computers ■Computers, etc. *For more details, please refer to the PDF document or feel free to conta...
Electroless UBM plating technology for power devices
- overview
- 【Supported Materials】 ■Materials: Power semiconductors such as Si, SiC, GaO, GaN ■Al-based electrodes: Pure Al, AlSi, AlSiCu, AlCu *For mor...
- Application/Performance example
- 【Applications】 ■ Power devices for automotive and home appliances ■ Sensor devices ■ ASIC devices for MEMS, etc. *For more details, please ...
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清川メッキ工業
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